MSI IPC announced the MS-98M3 3.5″ single board computer with 11th generation Intel IOTG Core processor, codenamed Tiger Lake-UP3 series for high-performance and efficiency. Intel Lake-UP3 series of ultra-low power and high-performance products, provides the industry with more reliability and high durability with lower power consumption under the same workload. It has up to four-screen display functions and a rich variety of high and low-speed I/O connection interfaces. The unique heat dissipation design is strong, durable and highly reliable. The wide temperature series can support long-term stable operation in the harsh operating temperature environment of -40~+85°C.
MS-98M3 is equipped with MSI’s proprietary heat dissipation design solution, which uses pure copper combined with aluminum heat sink to conduct high heat of the processor and chipset in real time and realizes rapid heat dissipation based on a fan less design. The heatsink itself, combined with a proprietary screw set, automatically adjusts and eases the adhesion between the device and the processor and chipset to maintain close contact for more efficient heat transfer.
The single board computer series has been equipped with upgraded high-speed I/O interfaces and multiple latest M.2 expansion interface, such as M.2 M-key supports PCIe Gen4 x4 NVMe SSD, the storage read and write speed is nearly 5 times faster than the traditional SATA-3.0 interface, the new M.2 B-key interface design. It supports the latest 5G wireless modules to greatly improve the transmission capacity in the field of edge applications.
MS-98M3 once again leads the industry in providing 2 sets of built-in display output LVDS (2K) and (4K) resolution interface display directly on high-end single board computer products, suitable for multi-tasking such as machine vision and digital signage and retail market systems the project requires the application field of dual display.
